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IMS

IMS: Metal backed PCBs for thermal management applications

Standard construction

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Insulated Metal Substrate

Circuit layer: This is the printed circuit foil with copper thickness ranging from 35µm to 210 µm
Dielectric layer: Electrical Isolation with minimum thermal resistance with thickness ranging from 75µm to 150 µm copper & thermal conductivity ranging from 1W/mK to 3W/mK.
Base layer: It’s often aluminum but copper could also be used. Base Layer thickness is ranging from 0,5mm to 3mm

IMS: Metal backed PCBs for thermal management applications

Benefits

  • Lower operating temperature
  • Increased power density
  • Improved product thermal and mechanical performance
  • Improved product durability
  • Reduce heatsinks and other mounting devices including thermal interface material

Typical Aplications

  • Power applications
  • LEDs
  • Motor drives

Released technologies